TOP MONOCRYSTALLINE SILICON SECRETS

Wire-saw wafer slicing has become the critical manufacturing systems for industrial crystalline silicon PV cells, and improvements in wafer slicing know-how have resulted in a reduction in Uncooked wafer thickness from 370 μm to 180 μm given that 1997 for Sharp industrial polycrystalline-silicon cells (Figure 6). To introduce wafers thinner than